DRAM

SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this premium type of DRAM. On Tuesday, buried in a note about qualifying the company's 1bnm fab process, the the manufacturer remarked for the first time that it is working on next-generation HBM3E memory, which will enable speeds of up to 8 Gbps/pin and will be available in 2024. Contemporary HBM3 memory from SK Hynix and other vendors supports data transfer rates up to 6.4Gbps/pin, so HBM3E with an 8 Gbpis/pin transfer rate will provide a moderate, 25% bandwidth advantage over existing memory devices. To put this in context, with a single HBM stack using a 1024-bit wide...

Micron Expects Impact as China Bans Its Products from 'Critical' Industries

In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...

12 by Anton Shilov 6 days ago

Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025

Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...

10 by Anton Shilov on 5/19/2023

Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works

Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power...

16 by Anton Shilov on 5/18/2023

As The Demand for HBM Explodes, SK Hynix is Expected to Benefit

The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...

9 by Anton Shilov on 4/18/2023

Samsung Becomes Latest Memory Fab to Cut Production Amidst Post-Pandemic Slump

Following an ongoing slump in demand that has impacted the entire memory industry over the last several months, Samsung this week has become the latest memory foundry to announce...

11 by Anton Shilov on 4/7/2023

Kingston Launches Fury Beast And Fury Renegade DDR5 Memory in White

Kingston Fury, the gaming and high-performance division of Kingston Technology Company, Inc., has expanded the aesthetics of the company's Fury DDR5 memory portfolio. The Fury Beast and Fury Renegade...

17 by Zhiye Liu on 3/28/2023

SK hynix Intros LPDDR5T Memory: Low Power RAM at up to 9.6Gbps

In a bit of a surprise move, SK hynix this week has announced a new variation of LPDDR5 memory technology, which they are calling LPDDR5T. Low Power Double Data...

10 by Ryan Smith on 1/25/2023

Micron Announces 20-Year Plan To Build $100 Billion U.S. Fab Complex

Now that the U.S. government has finally settled the matter of whether it would be providing subsidies to entice chip fabs to setup shop within the U.S., those fabs...

48 by Anton Shilov on 10/10/2022

Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.

Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...

23 by Anton Shilov on 9/14/2022

Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling

Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...

26 by Anton Shilov on 8/19/2022

Crucial Ballistix Memory Goes End-of-Life, Micron Realigns its DRAM Strategy

Underscoring the fast-paced nature of the computer hardware market, Micron this week has decided to discontinue all of its current Crucial Ballistix memory products. The move to end-of-life (EOL...

13 by Gavin Bonshor on 2/17/2022

ASUS Demonstrates DDR5 to DDR4 Converter Card

One of the key issues with purchasing a modern Alder Lake system today is the cost of the memory, especially when an enthusiast wants to use DDR5. Due to...

31 by Dr. Ian Cutress on 12/30/2021

SK Hynix to Manufacture 48 GiB and 96 GiB DDR5 Modules

Today SK Hynix is announcing the sampling of its next generation DDR5 memory. The headline is the commercialization of a new 24 gigabit die, offering 50% more capacity than...

22 by Dr. Ian Cutress on 12/14/2021

Samsung Announces First LPDDR5X at 8.5Gbps

After the publication of the LPDDR5X memory standard earlier this summer, Samsung has now been the first vendor to announce new modules based on the new technology. The LPDDR5X standard...

19 by Andrei Frumusanu on 11/9/2021

SK Hynix Announces Its First HBM3 Memory: 24GB Stacks, Clocked at up to 6.4Gbps

Though the formal specification has yet to be ratified by JEDEC, the memory industry as a whole is already gearing up for the upcoming launch of the next generation...

19 by Ryan Smith on 10/20/2021

Samsung Teases 512 GB DDR5-7200 Modules

This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point...

27 by Dr. Ian Cutress on 8/22/2021

JEDEC Publishes LPDDR5X Standard at up to 8533 Mbps

JEDEC and the JC-42.6 Subcommittee for Low Power Memories has announced the publication of the new JESD209-5B standard which now includes improvements to LPDDR5, as well as an extension...

17 by Andrei Frumusanu on 7/29/2021

Computex 2021: G.Skill Trident Z Royal Elite With DDR4-4000 CL14, Tight Latencies

During Computex 2021, G.Skill has announced a couple of new memory kits featuring its regal-looking Trident Z Royal Elite heatsinks. Available with super tight primary latencies of CL14, the...

29 by Gavin Bonshor on 6/8/2021

Computex 2021: TeamGroup Announces its First DDR5-4800 Memory Module

Back in December 2020, TeamGroup announced its intentions for the switch to DDR5 memory on future platforms. During Computex 2021, TeamGroup claims it has 'successfully taken the lead over...

12 by Gavin Bonshor on 6/7/2021

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